View BZA968AVL_328177.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

DISCRETE SEMICONDUCTORS
DATA SHEET
M3D743
BZA900AVL series Quadruple low capacitance ESD suppressor
Product specification Supersedes data of 2003 Apr 15 2003 Oct 20
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
FEATURES * Low diode capacitance * Low leakage current * SOT665 surface mount package * Common anode configuration. APPLICATIONS * Communication systems * Computers and peripherals * Audio and video equipment. DESCRIPTION Monolithic transient voltage suppressor diode in a five lead SOT665 package for 4-bit wide ESD transient suppression. MARKING TYPE NUMBER BZA956AVL BZA962AVL BZA968AVL ORDERING INFORMATION PACKAGE TYPE NUMBER NAME BZA956AVL BZA962AVL BZA968AVL - - - DESCRIPTION plastic surface mounted package; 5 leads plastic surface mounted package; 5 leads plastic surface mounted package; 5 leads MARKING CODE V3 V2 V1
1 2 3
handbook, halfpage 5
BZA900AVL series
PINNING PIN 1 2 3 4 5 cathode 1 common anode cathode 2 cathode 3 cathode 4 DESCRIPTION
4 1 3 2 4 5
MGW315
Fig.1 Simplified outline (SOT665) and symbol.
VERSION SOT665 SOT665 SOT665
2003 Oct 20
2
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL Per diode IZ IF IFSM Ptot PZSM Tstg Tj ESD working current continuous forward current non-repetitive peak forward current total power dissipation non repetitive peak reverse power dissipation storage temperature junction temperature electrostatic discharge HBM MIL-Std 883 Notes 1. DC working current limited by Ptot(max). 2. Device mounted on standard printed-circuit board. ESD STANDARDS COMPLIANCE STANDARD IEC 61000-4-2, level 4 (ESD) HBM MIL-Std 883, class 3 THERMAL CHARACTERISTICS SYMBOL Rth j-a Rth j-s PARAMETER thermal resistance from junction to ambient thermal resistance from junction to solder point; note 1 CONDITIONS all diodes loaded one diode loaded all diodes loaded >4 kV Tamb = 25 C Tamb = 25 C tp = 1 ms; square pulse Tamb = 25 C; note 2; see Fig.5 square pulse; tp = 1 ms PARAMETER CONDITIONS
BZA900AVL series
MIN. - - - - - -65 -
MAX.
UNIT
note 1 200 3.5 335 6 +150 150 - -
mA mA A mW W C C kV kV
IEC 61000-4-2 (contact discharge) 15 10
CONDITIONS >15 kV (air); >8 kV (contact discharge)
VALUE 370 135 125
UNIT K/W K/W K/W
Note 1. Solder point of common anode (pin 2).
2003 Oct 20
3
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
ELECTRICAL CHARACTERISTICS Tj = 25 C unless otherwise specified. SYMBOL VF IR PARAMETER forward voltage reverse current BZA956AVL BZA962AVL BZA968AVL VZ working voltage BZA956AVL BZA962AVL BZA968AVL rdif differential resistance BZA956AVL BZA962AVL BZA968AVL SZ temperature coefficient BZA956AVL BZA962AVL BZA968AVL Cd diode capacitance BZA956AVL BZA962AVL BZA968AVL diode capacitance BZA956AVL BZA962AVL BZA968AVL IZSM non-repetitive peak reverse current BZA956AVL BZA962AVL BZA968AVL tp = 1 ms; Tamb = 25 C - - - f = 1 MHz; VR = 5 V - - - f = 1 MHz; VR = 0 - - - IZ = 1 mA - - - IZ = 1 mA - - - VR = 3 V VR = 4 V VR = 4.3 V IZ = 1 mA 5.32 5.89 6.46 - - - CONDITIONS IF = 200 mA - MIN.
BZA900AVL series
TYP. - - - - 5.6 6.2 6.8 - - - 1.3 2.4 2.9 22 18 16 12 9 8 - - -
MAX. 1.2 200 100 20 5.88 6.51 7.14 200 150 100 - - - 28 22 19 17 12 11 0.90 0.85 0.80
UNIT V nA nA nA V V V mV/K mV/K mV/K pF pF pF pF pF pF A A A
2003 Oct 20
4
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
BZA900AVL series
handbook, halfpage
10
MLE001
102 handbook, halfpage
MLE003
IZSM (A)
PZSM (W) BZA956AVL BZA956AVL
1
10 BZA968AVL BZA962AVL/BZA968AVL
BZA962AVL
10-1 10-2
10-1
1
tp (ms)
10
1 10-2
10-1
1
tp (ms)
10
Fig.3 Fig.2 Maximum non-repetitive peak reverse current as a function of pulse time.
Maximum non-repetitive peak reverse power dissipation as a function of pulse duration (square pulse).
handbook, halfpage
26 Cd 22
MLE002
MGT586
handbook, halfpage
400
(pF)
Ptot (mW) 300
18 200 BZA956AVL 14 BZA962AVL 100 10 BZA968AVL 6 0 1 2 3 4 VR (V) 5 0 0 50 100 Tamb (C) 150
Tj = 25 C; f = 1 MHz.
Fig.4
Diode capacitance as a function of reverse voltage; typical values.
Fig.5 Power derating curve.
2003 Oct 20
5
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
BZA900AVL series
handbook, full pagewidth
ESD TESTER RZ CZ
450
RG 223/U 50 coax
10x ATTENUATOR note 1
DIGITIZING OSCILLOSCOPE 50
IEC 1000-4-2 network CZ = 150 pF; RZ = 330
1/4 BZA900AVL
Note 1: attenuator is only used for open socket high voltage measurements
vertical scale = 200 V/div horizontal scale = 50 ns/div
vertical scale = 5 V/div horizontal scale = 50 ns/div
BZA968AVL GND3
BZA962AVL GND2
GND GND1 unclamped +1 kV ESD voltage waveform (IEC 1000-4-2 network)
BZA956AVL
clamped +1 kV ESD voltage waveform (IEC 1000-4-2 network)
GND
GND
vertical scale = 200 V/div horizontal scale = 50 ns/div
vertical scale = 5 V/div horizontal scale = 50 ns/div
unclamped -1 kV ESD voltage waveform (IEC 1000-4-2 network)
clamped -1 kV ESD voltage waveform (IEC 1000-4-2 network)
MLE005
Fig.6 ESD clamping test set-up and waveforms.
2003 Oct 20
6
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
APPLICATION INFORMATION Typical common anode application
BZA900AVL series
A quadruple transient suppressor in a SOT665 package makes it possible to protect four separate lines using only one package. Two simplified examples are shown in Figs.7 and 8.
handbook, full pagewidth
keyboard, terminal, printer, etc.
I/O
A B C D FUNCTIONAL DECODER
BZA900AVL GND
MLE008
Fig.7 Computer interface protection.
handbook, full pagewidth
VDD address bus VGG
RAM
ROM
I/O
data bus
CPU CLOCK
control bus
BZA900AVL GND
MLE009
Fig.8 Microprocessor protection.
2003 Oct 20
7
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
Device placement and printed-circuit board layout Circuit board layout is of extreme importance in the suppression of transients. The clamping voltage of the BZA900AVL is determined by the peak transient current and the rate of rise of that current (di/dt). Since parasitic inductances can further add to the clamping voltage (V = L di/dt) the series conductor lengths on the printed-circuit board should be kept to a minimum. This includes the lead length of the suppression element. In addition to minimizing conductor length the following printed-circuit board layout guidelines are recommended: 1. Place the suppression element close to the input terminals or connectors 2. Keep parallel signal paths to a minimum 3. Avoid running protection conductors in parallel with unprotected conductors 4. Minimize all printed-circuit board loop areas including power and ground loops 5. Minimize the length of the transient return path to ground 6. Avoid using shared transient return paths to a common ground point.
BZA900AVL series
2003 Oct 20
8
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
PACKAGE OUTLINE Plastic surface mounted package; 5 leads
BZA900AVL series
SOT665
D
A
E
X
S
YS HE
5
4
A
1
e1 e
2
bp
3
wMA Lp detail X
c
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 0.6 0.5 bp 0.27 0.17 c 0.18 0.08 D 1.7 1.5 E 1.3 1.1 e 1.0 e1 0.5 HE 1.7 1.5 Lp 0.3 0.1 w 0.1 y 0.1
OUTLINE VERSION SOT665
REFERENCES IEC JEDEC EIAJ
EUROPEAN PROJECTION
ISSUE DATE 01-01-04 01-08-27
2003 Oct 20
9
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION
BZA900AVL series
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2003 Oct 20
10
Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R76/03/pp11
Date of release: 2003
Oct 20
Document order number:
9397 750 11935

▲Up To Search▲

Price & Availability of BZA968AVL

	To Download BZA968AVL Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .